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bcpcba 
support@bcpcba.comOur Advantage
PCB Assembly Types We Offer
Surface Mount (SMT) Assembly
SMT is currently the most popular assembly process.
Our advanced PCBA assembly process and equipment
can entirely guarantee the quality of products
Through-Hole PCB Assembly
Through-Hole PCB Assembly is the process of assembling by
attaching components to base material such as copper,
glass fiber reinforced epoxy, or pre-tinned copper-clad laminate.
Ball-Grid-Array (BGA) Assembly
BGA assembly is a technique to assemble with ball grid arrays.
The main objective is to provide an automated solution
for soldering the balls in the proper position.
Mixed Assembly
Mixed PCB Assembly is achieved by using a different PCB assembly process .
The advantage of Mixed assembly is that it can be done
with no need for specialized equipment.
Our PCB Assembly Capacities
| Parameters： | Capacity |
| Quality grade: | Standard IPC 2/3 |
| Order quantity: | Our minimum is as low as 1 pieces. But we recommend our customers purchase at least 3 prototypes for their own analysis and testing |
| PCB Layer: | 1-30 layers |
| Component sourcing: | In full turnkey PCB assembly, we source all components for you from a reputable supplier. In partial turnkey PCB assembly, you provide us with some components and we take care of the rest. In consigned PCB assembly, you supply us with all the components for assembling. |
| PCB Spec requirements: | PCB whose width/length is less than 30mm ought to be panelized. Max board size: 500 by 450 mm. Board type: Rigid PCBs, Flex PCBs, Metal Core PCBs, etc. Surface finish: lead/lead-free HASL, ENIG, silver, OSP. |
| Assembly types: | Surface mount technology(SMT),Though-hole,mixed technology (SMT &Through-hole), single or double-sided placement, conformal coating, and shield cover assembly for EMI emission control. |
| Solder type: | Lead-free -RoHS compliant |
| Components types: | SMT 01005 or larger, BGA 0.35mm pitch, POP (package on package), WLCSP 0.35mm pitch, hard metric connectors, and cable & wire. |
| Stencils: | We apply laser cut stabiles steel stencils to achieve high reliability for fine pitch and BGA components. Besides, we offer Nano coating for customers who need it. |
| Testing: | Various testing method will be applied to the assembled boards before the final shipment: Visual inspection: general quality check. AOI: checks for solder paste, 0201 components,missing components and polarity. X-ray: checks for BGAs, QFN and bare circuit boards Functional test : following your test procedures test functionality and performance to ensure alignment with expectations. |
| Repair & Rework: | Our BGA reballing service with which we can safely remove the misplaced BGA, reball it and put it back on the PCB correctly. It is cost-effective. |
| Build time: | 1 -5 days, 1 -2 weeks, or scheduled deliveries. |
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